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    JASPER X1: High Power Femtosecond Fiber Laser

    The Jasper X1 is a high-performance femtosecond laser system designed for maximum flexibility and precision in demanding applications. It features extended burst lengths with flexible envelope adjustment (Custom Envelope Burst – CEB), along with tunable pulse durations of up to 20 ps. This allows for precise process development and optimization tailored to wide range of materials and applications.                                                      With Advanced Pulse-on-Demand (APoD) and nanosecond-level jitter, Jasper X1 delivers exceptional pulse timing precision – ideal for enhancing edge definition, corner processing, and maximizing duty cycles. Built as a robust, all-fiber, SESAM-free system, Jasper X1 ensures consistent performance, long-term stability, and true maintenance-free 24/7 operation.

     

    Key features

    • Proven stability & exceptional lifetime with average power of up to 60 W
    • Maximum pulse energy of up to 200 µJ
    • < 270 fs – 20 ps pulse tunability
    • Superior beam quality thanks to all-fiber optical construction
    • Advanced Pulse-on-Demand and Custom Envelope Burst with bursts of up to 80 pulses
    • Instantaneous external triggering, providing 100-fold accuracy improvement for the system precision
    • 5-year warranty on the oscillator and 2-yearwarranty on the complete laser as a standard

    Specifications

     

    Model JX30-100 JX30-200 JX30-200P JX60-200 JX60-200P
    Central Wavelength 1030 ± 5 nm
    Average Power 30 W 30 W 30 W 60 W 60 W
    Max. Pulse Energy 100 μJ 200 μJ 200 μJ 200 μJ 200 μJ
    Nominal Pulse Repetition Rate (PRR) 300 kHz 150 kHz 150 kHz 300 kHz 300 kHz
    Pulse Width < 270 fs < 270 fs < 270 fs < 270 fs < 270 fs
    Tuning Range <270fs-8ps <270 fs – 20 ps
    Pulse Repetition Rate (PRR) Single-Shot to 20 MHz (2)
    Pulse-on-Demand Max. PRR / Jitter Standard (based on pulse picker) Standard (based on pulse picker) Advanced
    1 MHz / < 50 ns
    Standard (based on pulse picker) Advanced
    1 MHz / < 50 ns
    Max. Burst Energy 100 μJ 300 μJ 300 μJ 400 μJ 400 μJ
    No. of Pulses in MHz Burst Mode 2 – 80 2 – 80 2 – 12 2 – 80 2 – 12
    Custom Envelope Burst (5) Optional Included Included
    Beam Quality, M2 < 1.2 (1.1 typical)
    Beam Circularity > 87%
    Beam Divergence < 1 mrad
    Beam Diameter 2.5 ± 0.5 mm (6)
    Polarization, PER Vertical, PER > 28 dB
    Beam Pointing Stability < 20 μrad/°C
    Long Term Power Stability – 100 h < 0.5 %
    Pulse-to-Pulse Energy Stability – 24 h < 1 %
    Triggering External / Internal
    Pulse Control Internal / External analog power modulation, Pulse picker, Burst mode, Custom Envelope Burst (CEB)
    Options Harmonic Module – 515 nm, 343 nm, 257 nm (automatic selection), Automated Mechanical Shutter
    Cooling Water

    Applications

    • Microelectronics: via drilling in glass, silicon, ceramics and organic substrates, panel cutting, dicing, glass cleaving, marking, repair, SLE, in-volume glass writing
    • Micromachining: precision drilling, cutting, trimming
    • Medical device manufacturing: stents, microfilters, microfluidics
    • Surface engineering: activation before plating/bonding/dispensing, patterning molds, functionalisation, wettability control
    • Material compatibility: semiconductors, metals, ceramics, glass, hard materials, crystalline materials, polymers

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