OPTEC LIGHTSHOT LSV3

Key Features

• Deep-UV excimer laser (193 nm or 248 nm) with air-cooled, small form factor
• Residue-free and athermal, resulting in minimal HAZ (Heat Affected Zone) and no damage to electrodes.
• Achieves sub-micron part positioning resolution and ablation depth control down to $100\text{ nm}$ per shot.
• Employs mask-projection optics and a flat, uniform beam for “photolithography precision” ablations.
• Utilizes Optec’s intuitive ProcessPower™ software for easy recipe development.
• Includes a pneumatic rotary chuck with collets and supports options for automatic catheter feeders.
• Features a live, zoom video microscope for viewing and an auto-focus function.
• High definition imaging down to $1.5\mu m$; sub-micron part positioning resolution and micron-level ablation accuracy
• A self-contained workstation for R&D or production.